[SatNews] Cobham announced today that its Semiconductor Solutions Colorado Springs facility has received the first MIL-PRF-38535 Class Y assembly certification awarded by the Defense Logistics Agency (DLA), Land and Maritime. DLA’s December 2013 release of MIL-PRF-38535 Revision K defines, for the first time, a Class Y designation for the use of ceramic non-hermetic packages in space applications. Specifically, the Class Y designation allows for the utilization of non-hermetic flip chip package technology. The Cobham Colorado Springs facility, formerly Aeroflex, has now been certified for Class Y flip chip assembly, the result of an August 2014 DLA audit to Revision K, and the Class Y requirements described therein.

“Cobham Semiconductor Solutions is proud to receive Class Y facility certification fromDLA,” said Rafi Albarian, Sr. Vice President and General Manager, Cobham Semiconductor  Solutions. “The Colorado Springs facility has long been certified to MIL-PRF-38535 (QML) level T, Q & V. We have since worked diligently to become certified for Class Y assembly, and are proud to be the first company to attain this status, all in the name of better serving our customers.”

“This Class Y certification is a culmination of our flip chip IR&D package development effort, the hard work of our Quality Assurance organization, and our collaborative supportof the JEDEC Class Y Task Group,” said Dr. Scott Popelar, manager of the Cobham Advanced Packaging Engineering group. “Attaining Class Y assembly certification is a major step towards Cobham offering its customers ASIC products in a flip chip, non hermetic package format, and keeps Cobham at the industry forefront of Class Ytechnology development and productization,” stated Popelar.

In addition to achieving the Class Y facility certification, Cobham is also in the final stages of their Class Y flip chip assembly technology qualification. The Class Y facility certification, combined with the flip chip technology qualification, will enable Class Y assembly of its UT1752FC flip chip LGA/CGA package, with qualification of heat sink and decoupling capacitor attach technologies to follow. The UT1752FC package is Cobham’s first Class Y standard package offering to be introduced in conjunction with its RadHardby- Design (RHBD) 90nm technology node (UT90nHBD), both targeted for final qualification in calendar year 2015.