...MILCOM, as well as the latest end-to-end solutions from the widest stable of high performance interconnects anywhere in the world. These new high-speed connectivity solutions will be on display at Booth 1708 on October 29-November 1, in Orlando, Florida. The following products and solutions will be featured:
- Advanced Composites & Antennas—High performance polymers and composite solutions for harsh, high temperature and corrosive environments that meet critical demands for thermal management, EMI shielding and enhanced SWaP
- CeeLok FAS-T Connector—The most rugged, small form factor, field terminable, I/O connector that meets high-speed 10Gb/s Ethernet performance
- Cold Applied Splice—Designed as a single component in-line splice to provide high environmental protection to seal the termination from moisture and provide electrical isolation
- Deutsch MIL-DTL 38999 Series Connectors—Circular connectors in accordance with MIL-DTL-38999 SIII
- Deutsch Wildcat Connectors—Specifically designed for harsh environment applications where space and weight savings are of critical importance
- Expanded Beam Optical Connectors—Rugged optics and fiber optic technology provides a clean transmission path in bandwidth and capacity
- Mezalok Mezzanine Connector—A high-reliability mezzanine connector that more than doubles the speed and durability of competing technology, making it the most viable option for adverse environments
- Power Distribution Panels—HARTMAN AC and DC power distribution units (PDUs) and KILOVAC DC PDUs from TE are designed, built and qualified to meet specific requirements
- RT-555 High Temperature Heat Shrink Tape—A bi-layer, side-entry, heat-recoverable sealing product for wire harness bundles saves time and resources
