[SatNews] TE Connectivity (TE), along with their DEUTSCH division, is featuring it's latest solutions for reducing size, weight and power (SWaP) while increasing power/data delivery in unmanned vehicle systems market at the AUVSI Unmanned Systems Exhibition, Booth #3628, August 12-15, 2013, in Washington, D.C. TE is featuring the following interconnect solutions:
- Relays and Contactors
With one of the largest QPL offerings in the industry, TE offers a broad range of relays and contactors, switching power from signal level to hundreds of kilowatts. TE's components maintain advanced reliability in some of the smallest, lightest weight packages in the industry. - Expanded Beam Fiber Optics
TE's rugged optics and fiber optic technology provides a clean transmission path in bandwidth and capacity. - MULTIGIG RT 2-R Connectors
TE will be showcasing a rugged, lightweight, high-speed board-to-board interconnect that is compliant to VITA 46 standard. The connector system features the modularity and flexibility of the MULTIGIG RT 2 connector, with a new quad-redundant contact structure designed for high vibration levels. - CeeLok FAS-T Connector
The CeeLok FAS-T connector is one of the most rugged, small, 10GB Ethernet, field terminable I/O connectors in the aerospace, defense and marine marketplace. - Mezalok Mezzanine Connector
Engineered for high-speed reliability across some of the most adverse environments, the Mezalok connector enables 5 GHz+ data rates coupled with a four-point redundant contact system based on the VITA 61 standard. - DEUTSCH Wildcat Connectors
The range of Wildcat high-performance circular connectors from DEUTSCH is specifically designed for harsh environment applications where space and weight-saving are of critical importance. - DEUTSCH 369 Series Connectors
The 369 Series has been developed to help provide a range of high reliability, lightweight, compact and cost-efficient connectors suited to aerospace and other harsh environment applications. - Repair Products
TE's repair products are designed to help significantly reduce the amount of labor hours spent by maintainers on repairing electrical wiring harnesses and damaged wires.
Antennas and Enclosures
TE has developed wideband (>2:1 bandwidth) microstrip patch antenna technology enabling the construction of wideband low profile arrays. Compared with competitive technologies, TE's array designs have smaller footprints and lower profiles for the same operating bands. The carbon fiber reinforced composites support replacement of many aluminum structures with conductive composite, helping to save up to40 percent weight per part. The glass fiber reinforced radomes are molded parts, allowing TE to make consistent parts while saving significant cost versus traditional radomes built from a hand lay up process. These technologies combine to produce lightweight, low profile antennas with consistent performance.